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Top Products Wafer Probers PCP-302N

Wafer Prober
PCP-302N





 PCP-302N

The PCP-302N is a wafer prober developed to respond to our customer's request flexibly on the basis of our experience and technology.
By adopting PFC original XY Compensation and Profiling function, PCP-302N can compensate the position even for the wafer's expansion caused by the temperature.


 FEATURES
Effective compensation even for the wafer's expansion caused by the temperature.
Successful record of Alignment for customers' products is 100%. (Record only in Japan)
Probing more than two points by moving in a chip (Micro Probing)
Surface finish for your intended usage, such as gold plate, nickel plate, etc.
Low noise: More than -80dB on the chuck
 (Reference Value: 30KHZ to 30MHZ Loop ANT actual measurement)
High rigidity cabinet made by the iron surface plate and the welding frame realizes low vibration
Low cost and High throughput
Small space (Footprint), power-saving design
Stable operation (more than MTBF5000 hours)


 OPTIONS
Supports chip probing by the wafer adapter.
Large diameter Pre-alignment chuck can handle a warped wafer, thin wafer and TAIKO™ Wafer
Quick Loader can reduce the Load/Unload time per sheet to half.
Capable of the high temperature range (50 ℃ to 150 ℃) and the precise thermal control (25℃±0.3℃).
Non-magnetic spec to handle a magnetic device.
 ※Reference value (standard system): Chuck surface: 0.04mT
                    Transporting rout: 0.2mT


 SPECIFICATION

Wafer size 200mm (8 inch) to 300mm (12 inch)
Probing area Wafer: φ300mm
XY stage Driven by linear motor (Repeat accuracy:1um)
Footprint Small space: (W)1615mm × (D)1000mm


 OTHERS
Sales achievement: PCP series more than 430 sets (As of April 2018)
We can respond to the request from a customer flexibly.
We can offer discount for the purchase of several sets together.

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